China LED Nail Lamp shell Manufacturers, Suppliers, Factory

The rise of CNC processing and production technologies such as 3D printing and CNC processing has brought excitement to the jewelry industry. HY prototypes, visualizes and iterates on their designs when prototyping their jewelry designs.

Sheet metal manufacturing is one of the most popular manufacturing processes in non-standard production.

Xiamen, this beautiful coastal city, with its unique charm and hospitable humanistic atmosphere, has once again become a witness to Sino-foreign cooperation. Under the careful planning and organization of the Foreign Trade Department, HY welcomed the test pass of the 400-axis project. With the successful conclusion of the project, we not only reaped business success, but also left footprints of Sino-foreign friendship on the streets and alleys of Xiamen Zhongshan Road.

​On April 7, 2024, HY received a visit from three distinguished customers from the United States. Before the factory tour started, we held a meeting with the customer to introduce the company and factory equipment to each other to better understand the customer's needs and requirements.

The HONGYU metal junction box is made of 3mm thick cold-rolled steel plate and processed by laser cutting and one-piece stamping forming technology. The overall structure has no welding weaknesses. Its impact resistance meets the IK10 standard and can withstand mechanical shock of 10 joules, effectively protecting the internal circuits in scenarios such as equipment transportation and pipeline construction. Actual measurement data shows that after a drop test from a height of 2 meters, the box can still maintain an IP66 protection level, ensuring that dust and water droplets cannot enter.

Copper clips are commonly used in high-performance electronic components and are a key interconnect component widely used in high-power packages, such as MOSFETs (metal oxide semiconductor field effect transistors) and IGBTs (insulated gate bipolar transistors). Copper clips can create electrical and thermal paths between lead terminals, chips and substrates, thereby improving the thermal management performance of the equipment, and are an important component of the power module structure.